发明名称 |
UNSUPPORTED POLISHING BELT FOR CHEMICAL MECHANICAL POLISHING |
摘要 |
A belt (102) for polishing a workpiece such as a semiconductor wafer (116) in a chemical mechanical polishing system (100) includes a polymeric layer forming an endless loop and having a polishing surface (140) on one side of the endless loop. The belt is manufactured by molding a polymeric material such as urethane in a cylindrical mold. The belt is thus made from a single layer, reducing weight, size, cost and maintenance requirements. |
申请公布号 |
WO0115867(A1) |
申请公布日期 |
2001.03.08 |
申请号 |
WO2000US24207 |
申请日期 |
2000.08.31 |
申请人 |
LAM RESEARCH CORPORATION;XU, CANGSHAN;LOMBARDO, BRIAN, S. |
发明人 |
XU, CANGSHAN;LOMBARDO, BRIAN, S. |
分类号 |
B24B21/00;B24B37/20;B24B37/26;B24D7/12;B24D11/00;B24D18/00;H01L21/304 |
主分类号 |
B24B21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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