METHOD OF MANUFACTURING CARD

摘要

A method of manufacturing a card wherein parts mounted or formed on a substrate, such as an IC chip, capacitors, and an antenna coil, cause no undulations to appear on the card surface. Substrates are continuously supplied together with a pair of sheet materials between which the substrates are inserted. Adhesive fluid is supplied between the sheet materials and the substrate and cured while keeping the distance between the pair of sheet materials constant.