Method and apparatus for mounting components

摘要

To provide a method and apparatus for mounting components capable of mounting even such components as having narrow inter-component distances without producing any interference between already mounted components and suction nozzles or components being suction-held by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting the electronic components on a printed circuit board, includes a control section containing information on the components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that the components to be mounted are mounted in ascending order of height.