| 摘要 |
In a substrate-integration-type thin-film solar cell module wherein an element is directly formed on a transparent insulating substrate (1), wiring (5, 5') between a bus region (3, 3') and a terminal box (34) is formed of a solder-plated copper foil (4, 4'). To ensure insulation between a device (100) surface (2) and the solder-plated copper foil, an insulating sheet (7) buried in a filler is inserted in a gap therebetween. A glass nonwoven fabric sheet or a 160 DEG C-heat-resistant synthetic fiber fabric sheet can be used for the insulating sheet (7). Contact between an edge of an opening (14) in a back protection cover (13) and the wiring (5, 5') is prevented by positioning output wiring by means of an insulating sheet portion. An insulating sheet (7) for preventing entrance of water from the opening is disposed at the opening. <IMAGE> |
