FERROELECTRIC THICK-LAYER STRUCTURES BASED ON LEAD PEROVSKITES AND METHOD FOR THEIR PRODUCTION

摘要

The subject of the present invention is ferroelectric thick-layer structures based on load perovskites on an aluminium oxide substrate. The invention exploits the good adhesion between lead perovskites and a substrate made of aluminium oxide, and between lead perovskites and platinum, and thereby avoids a mechanically unstable contact between the platinum and the aluminium oxide substrate. According to the invention, this problem is solved using a thick-layer structure in which the aluminium oxide substrate is in contact with a layer of lead perovskite, onto which a further electrode layer is applied. Electrodes are improved with the use of a composite of a precious metal and lead perovskite. The method for the preparation of thick-layer structure is simplified by consecutive printing of layers and simultaneous firing of all layers. If lead perovskites are fired to closed porosity at a temperature of up to 1050 DEG C, gold can be used as the electrode material instead of platinum. This eliminates the need for an intermediate lead perovskite binding layer between the aluminium oxide substrate and the gold electrode.