| 发明名称 |
Polishing apparatus and dressing method |
| 摘要 |
<p>An apparatus for polishing a surface of a substrate by slidingly engaging the surface with a polishing surface of an abrasive member has a dressing member (11a,11b) for dressing the polishing surface of the fixed abrasive member. The dressing member (11a,11b) has a dressing surface provided with projections having an angular portion of an obtuse angle ( alpha , beta ) of not less than (100 DEG ). <IMAGE> <IMAGE></p> |
| 申请公布号 |
EP1080839(A2) |
申请公布日期 |
2001.03.07 |
| 申请号 |
EP20000117337 |
申请日期 |
2000.08.21 |
| 申请人 |
EBARA CORPORATION |
发明人 |
MATSUO, HISANORI;HIYAMA, HIROKUNI;WADA, YUTAKA;HIROKAWA, KAZUTO |
| 分类号 |
B24B49/14;B24B53/00;B24B53/007;B24B53/017;B24B53/02;B24B53/095;B24B53/12;B24B55/02;H01L21/304;(IPC1-7):B24B37/04 |
主分类号 |
B24B49/14 |
| 代理机构 |
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