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发明名称
可控制之封盖离形方法及其离形结构
摘要
一种可控制之封盖离形方法及其离形结构。封盖离形结构至少包括:一承载基材、一黏性材料、以及一封盖。黏性材料系涂布于承载基材上。封盖系位于黏性材料之上方,用以接合于一晶圆上。黏性材料系用以控制封盖于晶圆接合后脱离承载基材。
申请公布号
TW200830433
申请公布日期
2008.07.16
申请号
TW096100973
申请日期
2007.01.10
申请人
日月光半导体制造股份有限公司
发明人
王盟仁
分类号
H01L21/50(2006.01);H01L23/02(2006.01);H01L23/28(2006.01)
主分类号
H01L21/50(2006.01)
代理机构
代理人
林素华
主权项
地址
高雄市楠梓加工区经三路26号
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