Chip-sized semiconductor device

摘要

A chip-sized semiconductor device includes a semiconductor element (10) having a plurality of electrodes and a plurality of connecting pads (16) electrically connected to the respective electrodes. A connecting board (22) includes a base substrate (24) having a first surface and a second surface, a plurality of connecting holes (25) extending from the first surface to the second surface, a plurality of lands (14) formed on the first surface to close the respective connecting holes (25), the lands (14) being arranged in conformity with positions of the connecting pads of the semiconductor element (10), and each of the connecting pads (16) having a surface area smaller than that of the land (14). The semiconductor element (10) is mounted on the connecting board (22) in such a manner that the connecting pads (16) of the semiconductor element (10) are electrically connected to the respective lands (14) of the connecting board (22) by means of a plurality of bumps (18), respectively. A plurality of external connecting terminals (20) on the second surface of the base substrate (24) are in contact with the respective lands (14) through the respective connecting holes (25).