BLP STACK AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A BLP(Bottom Lead Package) stack and a method for fabricating the same are provided to extend capacity by using a BLP. CONSTITUTION: An upper lead portion(110) of a three-dimensional BLP(10) is directed to a lower direction. A spacer(30) is dotted on a bottom portion of the three-dimensional BLP(10). A standard BLP(20) is loaded on an upper portion of the three-dimensional BLP(10). The three-dimensional BLP(10) and the standard BLP(20) are clamped simultaneously by a fixing jig(5). The fixing jig(5) is shifted. The bottom lead portion(111) of the three-dimensional BLP(10) is connected electrically with the bottom lead portion(21) of the standard BLP(20) by dipping the bottom lead portion(111) of the three-dimensional BLP(10) and the bottom lead portion(21) of the standard BLP(20) to a solder(31) discharged from a solder supply tip(41) of a solder dipping device(4).