| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite ceramic that has both of the low thermal expansion properties and high stiffness and is suitable as a structural part for semiconductor-manufacturing equipment, measuring instrument, precision mechanical equipment and the like. SOLUTION: In a structural part constituted with a compact-substance composite ceramic comprising the first material and the second material, when the weight proportion, the density, the thermal expansion coefficient in the vicinity of the room temperature, and the Young's modulus of the first material are represented by W1 in %, ρ1, α1 and E1, respectively and the weight proportion, the density, the thermal expansion coefficient, and the Young's modulus of the second material are represented by W2 in %, ρ2, α2 and E2, respectively, the thermal expansion coefficient α in 1/ deg.C and the Young's modulus E in GPa of the composite material are represented as follows where -1×10-6<=α<=1×10-6 and E>=150: α=[(W1E1α1/ρ1)+(W2E2α2/ρ2)]/[(W1E1/ρ1)+(W2 E2/ρ2)]+A; E=B×[(W1E1ρ2)+(W2E2ρ1]/[(W1ρ2)+(W2ρ1)]; Where A=-0.5×106 to 1.0×106 and B=0.8 to 1.2. |
