发明名称 Cubic nitride semiconductor device and fabrication method of the same
摘要 The object of the present invention is to form a cubic nitride semiconductor layer of excellent surface flatness and crystallization on a cubic III-V family compound semiconductor substrate, featuring a fabrication method that comprises the steps of forming a cubic semiconductor layer 2 containing aluminum, nitriding one surface of the semiconductor layer 2 by heating in an atmosphere of a nitrogen compound and then supplying a nitrogen compound and a compound containing III family elements to form a cubic nitride semiconductor layer 3 on the semiconductor layer 2.
申请公布号 US6197441(B1) 申请公布日期 2001.03.06
申请号 US19980124889 申请日期 1998.07.30
申请人 MATSUSHITA ELECTRONICS CORPORATION 发明人 YURI MASAAKI;UEDA TETSUZO;BABA TAKAAKI
分类号 H01L29/20;C30B25/02;H01L21/20;H01L21/203;H01L21/205;H01L33/32;(IPC1-7):H01L21/203 主分类号 H01L29/20
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