| 摘要 |
PURPOSE: A method for fabricating a chip size package is provided to fabricate a chip size package by using an epoxy molding compound. CONSTITUTION: A matrix of an epoxy molding compound and a multitude of conductive metal core having a shape of straight line are formed on a base substrate. The conductive metal core is extended from the first surface to the second surface. A bump is formed on a surface of one side of the conductive metal core. A multitude of IC(Integrated Circuit) having a multitude of bump is fabricated. The bump of the IC corresponds to the bump of the conductive metal core by adhering the IC to the base substrate. An encapsulation process is performed around the IC. A multitude of conductive solder ball(44) is mounted on the conductive metal cores of the base substrate.
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