| 摘要 |
PROBLEM TO BE SOLVED: To provide a positioning method capable of improving the positioning accuracy of an object to be treated. SOLUTION: This method for positioning a wafer W comprises a process (a step S104) for detecting alignment data, which are rotated by +90 deg. with respect to the direction for treating the wafer and a process (a step S108) for detecting the alignment data which are rotated by -90 deg.. Then, positioning correction amounts can be calculated by using the alignment data which are rotated by +90 deg. with respect to the direction for treating the wafer and the alignment data which are rotated by -90 deg.. Thus, deviation in the detection position of alignment mark generated by an alignment optical system can be corrected, and the positioning accuracy can be improved.
|
