| 摘要 |
An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the first metal and the second metal are different, or (2) the following first metal-third metal-second metal bonded product, and wherein in (1) and (2), the first metal is bonded to the ceramic substrate; first metal: a metal selected from the group consisting of aluminum (Al), lead (Pb), platinum (Pt) and an alloy containing at least one of these metal components; second metal: a metal selected from the group consisting of copper (Cu), silver (Ag), gold (Au), aluminum (Al) and an alloy containing at least one of these metal components; and third metal: a metal selected from the group consisting of titanium (Ti), nickel (Ni), zirconium (Zr), molybdenum (Mo), tungsten (W) and an alloy containing at least one of these metal components.
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