发明名称 Fabrication method for bottom electrode of capacitor
摘要 A method of fabricating a bottom electrode for a capacitor is described in which a dielectric layer is formed on a substrate already comprising an isolation layer, an etching stop layer and a landing pad. Bit line structures and spacers are further formed on the dielectric layer. A node contact window opening is formed in the dielectric layer, exposing the landing pad, and a conformal first conductive layer is formed on the substrate. After a specially patterned mask layer is formed and the exposed first conductive layer is removed, an extended portion is formed connecting to the conductive layer to complete the fabrication of the columnar bottom electrode for a capacitor.
申请公布号 US6197700(B1) 申请公布日期 2001.03.06
申请号 US19990375179 申请日期 1999.08.16
申请人 UNITED MICROELECTRONICS CORP. 发明人 WANG CHUAN-FU;CHIOU JUNG-CHAO
分类号 H01L21/02;H01L21/8242;H01L27/108;(IPC1-7):H01L21/302;H01L21/461 主分类号 H01L21/02
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