<p>An inline vacuum processing apparatus for processing of substrates in vacuum comprises at least one load-lock chamber (10), at least two subsequent deposition chambers (4-7) to be operated with essentially the same set of coating parameters and at least one unload-lock chamber (10) plus means for transferring, post-processing and/or handling substrates through and in the various chambers. A method for depositing a thin film on a substrate in such processing system comprises the steps of introducing a first substrate into a load-lock chamber, lowering the pressure in said chamber; transferring the substrate into a first deposition chamber; depositing a layer of a first material on said first substrate using a first set of coating parameters; transferring said first substrate into a second, subsequent deposition chamber of said inline system without breaking vacuum and depositing a further layer of said first material on said first substrate using substantially the same set of parameters. Simultaneously to step f) a second substrate is being treated in said inline vacuum system according to step d).</p>
