| 摘要 |
PROBLEM TO BE SOLVED: To lessen the man-hours of the manufacture of a flip-chip mounting structure to aim at preventing the defective connection of a semiconductor chip with a substrate, a bridge and the like from being generated and to enhance the reliability of the connection of the chip with the substrate. SOLUTION: Metal stud bumps 3 are formed on electrodes 2 on a semiconductor chip 1, and the surfaces of copper electrodes 5 on a substrate 4 are subjected to plasma treatment for cleaning and activating the surfaces of the electrodes 5. The pointed parts of the bumps 3 are pressed to the surfaces, which were subjected to plasma treatment of the electrodes 5 to heat-treat the pointed parts of the bumps 3 at a temperature of 250 deg.C or thereabouts and the gold constituting the bumps 3 is made to react directly with the copper constituting the electrodes 5 for bonding the bumps 3 to the electrodes 5. |
