发明名称 THERMOFORMING MULTILAYERED STRUCTURE AND THERMOFORMED CONTAINER
摘要 PROBLEM TO BE SOLVED: To prevent a crack, a pinhole, local thickness, irregularity, etc., while obtaining high gas barrier properties by laminating a specific ethylene/vinyl alcohol copolymer resin layer and a polypropylene resin layer wherein an isotactic bond is a specific ratio through an adhesive resin layer. SOLUTION: An ethylene/vinyl alcohol copolymer resin (EVOH resin) A layer with an ethylene content of 20-60 mol% and a saponification value of 90% or more and a polypropylene resin (PP resin) C layer wherein an isotactic bond is 95% or more in pentad display are laminated through an adhesive resin B layer. As the EVOH resin, a resin compsn. comprising two or more kinds of ethylene/vinyl alcohol copolymers having different melting points is pref. As the adhesive resin B, a carboxylic acid modified polyolefinic resin is pref. from a viewpoint of adhesiveness. The PP resin C pref. has a melt flow rate at 230 deg.C under load of 2.160 g of 0.1-100 g/10 min.
申请公布号 JP2001058374(A) 申请公布日期 2001.03.06
申请号 JP19990236424 申请日期 1999.08.24
申请人 KURARAY CO LTD 发明人 HAYASHI NAHOTOSHI;SHIMO HIROYUKI
分类号 C08J5/00;B29C51/14;B32B27/28;(IPC1-7):B32B27/28 主分类号 C08J5/00
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