发明名称 EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition which can make a cured product excellent in heat resistance and useful for epoxy resin-based laminates, coating materials and the like by including a specific alkoxy group-containing silane- modified epoxy resin and a curing agent for epoxy resins. SOLUTION: This composition is obtained by including (A) an alkoxy group- containing silane-modified epoxy resin obtained by conducting alcohol elimination condensation reaction between (i) a bisphenol type epoxy resin preferably comprising bisphenol A type epoxy resin and (ii) a hydrolyzable alkoxysilane preferably comprising a poly(tetramethoxysilane) of the formula (Me is methyl; n is >=0 and the number n of recurring unit(s) is 1 to 7 on average) in the weight ratio of silica equivalent weight of the component ii to the weight of the component i of preferably 0.01 to 3 and (B) a curing agent for epoxy resins preferably comprising a polyamine-based curing agent, in the equivalent ratio of the function group having active hydrogen in the component B to the epoxy group in the component A of preferably around 0.2 to 1.5.
申请公布号 JP2001059013(A) 申请公布日期 2001.03.06
申请号 JP20000055859 申请日期 2000.03.01
申请人 ARAKAWA CHEM IND CO LTD 发明人 AIDA HIDEKI;TONO TETSUJI
分类号 C08G59/14;C08G59/24;C08G59/30;C08G59/50;(IPC1-7):C08G59/14 主分类号 C08G59/14
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