发明名称 |
Surface mounted type semiconductor device with wrap-around external leads |
摘要 |
A semiconductor device of surface-mount type includes a circuit strip tailored to have patterns projected, a semiconductor element fixedly joined to the circuit strip, and pads on the semiconductor element electrically connected by wires to the corresponding patterns on the circuit strip and sealed with a resin material. While the surface-mount type semiconductor device is adapted to be simple in structure and capable of high-density mounting, an appliance on which the semiconductor device is mounted and a method of producing the semiconductor device are also provided.
|
申请公布号 |
US6198160(B1) |
申请公布日期 |
2001.03.06 |
申请号 |
US19970955817 |
申请日期 |
1997.10.22 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
YAMAGUCHI TADASHI |
分类号 |
H01L21/60;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|