| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for cutting a semiconductor package, without having to increase the number of steps or needing masks. SOLUTION: For cutting a substrate 2 which has a plurality of mounted semiconductor chips 4 into a plurality of individual semiconductor chips 4, a camera 7 and a recognition circuit 8 recognize the cutting pattern of the substrate 2, an arithmetic circuit 9 specifies cutting positions using the recognition result by the recognizer circuit 8, a control circuit 10 and a drive circuit 11 are driven according to the computed result, and a nozzle 15 and a stage 6 are relatively moved, while feeding a blasting material from a discharging part 12 to the nozzle 15, thereby jetting cutting grains 16 against the substrate 2 from the nozzle 15 to cut the substrate 2. |
