SEMICONDUCTOR DEVICE, MANUFACTURE THEREOF, CIRCUIT BOARD AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To enable a semiconductor device to be enhanced in manufacturing yield by a method, wherein boards where wiring patterns are formed are employed. SOLUTION: A semiconductor device comprises boards 10 and 20, where wiring patterns 12 and 22 are each provided on their one surfaces and semiconductor chips 30 and 40 each of which is mounted on the boards 10 and 20 and are connected electrically to the wiring patterns 12 and 22. The wiring patterns 12 and 22 formed on the boards 10 and 20 are electrically connected together partially confronting each other.