| 摘要 |
PROBLEM TO BE SOLVED: To form bumps in a short time by splitting a wafer into chip- containing regions and forming the bumps by split wafer units. SOLUTION: A bump-forming device 10 is constituted of a tray 11 which is used for housing and transporting split wafers 1a, a stage 12 which sucks and heats the transported split wafers 1a when the wafers 1a are placed on the stage 12, and a bump-forming means 13 which forms bumps on aluminum electrode pads formed on the placed, sucked, and heated split wafers 1a. The bump forming means 13 form bumps on the split wafers 1a placed on the stage 12 while the means 13 is moved in the X-, Y-, or Z-direction by means of a drive device 17. The tray 11 carrying the split wafers 1a is taken out from a loader-side magazine and horizontally moved in the direction (a) by driving a drive device 14. When the tray 11 reaches above the stage 12, the tray 11 is moved vertically by driving the drive device 14. |
