发明名称 CONNECTION STRUCTURE OF SEMICONDUCTOR MODULE AND INVERTER
摘要 PROBLEM TO BE SOLVED: To enable a pair of semiconductor modules to be lessened in wiring capacitance. SOLUTION: In a semiconductor module 14A, composed of a pair of modules 17 and 18 arranged adjacent to each other, a second drain electrode 30 connects a first source electrode 24 of the semiconductor module 17 and a second drain electrode board 25 of a semiconductor module 18 together, where a current flowing through a vertical part 30b of the drain electrode 30 flows in parallel with and opposite to the flow direction to another current which flows through a vertical part 26b of a second source electrode 26 of the semiconductor module 18 arranged vertical to the second drain electrode board 25. Ribs 32a and 32b, which extend in the flow direction of a current flowing through a horizontal part 30a of the second drain electrode 30 along a bus electrode 13 are provided to the horizontal part 30a of the second drain electrode 30.
申请公布号 JP2001060659(A) 申请公布日期 2001.03.06
申请号 JP19990236016 申请日期 1999.08.23
申请人 TOYOTA AUTOM LOOM WORKS LTD 发明人 SOFUE KENICHI;FUKATSU TOSHISHIGE
分类号 H01L25/07;H01L23/48;H01L25/18;(IPC1-7):H01L25/07 主分类号 H01L25/07
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