| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for sticking an adhesive material by which bubbles can be eliminated, a wiring board, a semiconductor device, a method for manufacturing the semiconductor device, a circuit board, and electronic equipment. SOLUTION: A method of sticking adhesive material includes a step of sticking an adhesive material 14 provided on a wiring board 40 to the board 40 by pressing. A base substrate 42 has a plurality of punched first regions 48 and second regions 50 among the first regions 48. A wiring pattern 44 is formed in at least the first region s 48. Bubbles 54 are moved to the second areas 50 by pressing the part of the adhesive material 14 provided in the first regions 48, while the part is made to flow to the second regions 50. |
