发明名称 Rugged metal electrodes for metal-insulator-metal capacitors
摘要 Thin film metal-insulator-metal capacitors having enhanced surface area are formed by a substituting metal for silicon in a preformed electrode geometry. The resulting metal structures are advantageous for high-density DRAM applications since they have good conductivity, enhanced surface area and are compatible with capacitor dielectric materials having high dielectric constant.
申请公布号 US6197634(B1) 申请公布日期 2001.03.06
申请号 US19980161156 申请日期 1998.09.25
申请人 MICRON TECHNOLOGY, INC. 发明人 SCHUEGRAF KLAUS F.
分类号 H01L21/02;(IPC1-7):H01L21/336 主分类号 H01L21/02
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