| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus which improves wafer carrying to a chemical- mechanical polishing(CMP) head. SOLUTION: A carrying station 108 comprises a pair of buffer stations 120A, 120B and a carrying robot 122. Buffer stations and the ability of carrying two wafers 114 simultaneously by the carrying robot minimize the change time for loading and unloading of the wafers on a chemical-mechanical polishing system. Reducing the replacement time improves the number of wafers treated per hour by the chemical-mechanical polishing system. |
