发明名称 PLASMA TREATMENT SYSTEM AND PLASMA TREATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a plasma treatment system, capable of treating a work over approximately the entirety with plasma. SOLUTION: This system comprises a plasma treatment apparatus A, which has a cylindrical reactor tube 2 opened at one side as a blowout hole 1, a high voltage electrode 3 and a ground electrode 4, and operates a plasma-generating gas fed into the reactor tube 2, an A.C. electric field is applied between the high voltage electrode 3 and the ground electrode 4, to generate glow discharge in the reactor tube 2 at the atmospheric pressure, and a plasma jet 5 is blown from the blowout hole 1 of the reactor tube 2 on a work 6, and a plasma treatment apparatus drive means 30 for driving the plasma treatment apparatus A three-dimensionally, to adjust the blowout angle of the plasma jet 5 to the work 6. Due to the operation of this drive means 30, the plasma jet 5 can be fed surely.
申请公布号 JP2001060577(A) 申请公布日期 2001.03.06
申请号 JP19990233098 申请日期 1999.08.19
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KITAYAMA KAZUYA;SAWADA KOJI;TAGUCHI NORIYUKI;YASUDA MASAHARU;YAMAZAKI KEIICHI;NAKAMURA KOSUKE;NAKAZONO YOSHIYUKI
分类号 H01L21/302;C23F4/00;H01L21/3065;H05H1/24 主分类号 H01L21/302
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