发明名称 HEATING APPARATUS FOR PLASMA TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heating apparatus for plasma apparatus in which the problems of the workability, weight and manufacturing cost are solved. SOLUTION: This heating apparatus for plasma treatment apparatus heats two substrates in it, when a generated plasma decomposes a reactive gas to form a film on the substrate or to etch it. It has a bottomed rectangular cylindrical container cover 9, a heater element 7 hosed in the container cover and a lid cover 11 welded so as to close the opening of the container cover and comprises two one-side heat type heaters 8, having heating surfaces at the container cover and a holder 15 for holding the two heaters 8 opposed accross a space in-between for their heating surfaces 13 to face outward and the non- heating surfaces to face inward.
申请公布号 JP2001060556(A) 申请公布日期 2001.03.06
申请号 JP19990235508 申请日期 1999.08.23
申请人 MITSUBISHI HEAVY IND LTD 发明人 SASAGAWA EISHIRO;UENO MOICHI
分类号 H01L21/302;C23C16/46;H01L21/205;H01L21/3065;H05H1/46 主分类号 H01L21/302
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