发明名称 |
Method for producing printed wiring boards |
摘要 |
A method for producing printed wiring boards comprises the steps of perforating through holes at predetermined positions in an adhesive insulator sheet, filling the through holes with a conductive material such as a conductive paste or metal balls, transferring conductive wiring patterns that have been formed on surfaces of releasable supporting sheets onto the surfaces of the adhesive insulator sheet by heat and pressure. Simultaneously, interlayer via-connections are performed by means of the conductive material filled into the through holes.
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申请公布号 |
US6195882(B1) |
申请公布日期 |
2001.03.06 |
申请号 |
US19970924619 |
申请日期 |
1997.09.05 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TSUKAMOTO MASAHIDE;HASEGAWA MASANARU;HATANAKA HIDEO |
分类号 |
H05K3/20;H05K3/40;H05K3/46;(IPC1-7):H01K3/10 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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