METHOD FOR MANUFACTURING CONTACT BETWEEN DEVICES

摘要

PURPOSE: A method for manufacturing a contact between devices is provided to eliminate an isolating problem caused by misalignment of a contact plug, by forming a contact pad while forming a bit line. CONSTITUTION: The first insulating layer(212) is deposited on a semiconductor substrate having the first contact pad(210). The first insulating layer is etched to expose the first contact pad, and the first contact hole is formed. The first conductive layer(216) is formed on the first insulating layer to fill the first contact hole. The second conductive layer(218) is deposited on the first conductive layer. The second and first conductive layers are etched to expose the first insulating layer through a photo process, and a bit line(220) and the second contact pad(222) are formed. The second insulating layer(224) is deposited on the entire substrate. The second insulating layer is etched to expose an upper surface of the second contact pad, and the second contact hole is formed. The third conductive layer(228) is deposited on the second insulating layer to fill the second contact hole.