发明名称 SEMI-SOLID MOLD
摘要 PURPOSE: A semi-solid mold is provided to achieve the uniformity of a structure by preventing the generation of an air bubble for forming a product using a thixoforming method. CONSTITUTION: The semi-solid mold(1) for forming a product in a specific shape by charging a semi-melted metal at a high pressure consists of an upper die(4) and a lower die(5), and a cavity(2) defined between the upper die and the lower die. The cavity is communicated with an L-shaped gate(6) for charging a semi-melted billet(3) at a high pressure. A dispersion guider(7) and a rounded portion are formed on the inner end of the gate. A slider(9) operated by a cylinder is installed on the tip end of the gate. The slider has an oil heater hole(12) connected to an oil heater for heating the semi-solid mold. By using the semi-solid mold, parts made of metal complex materials in various shape is fabricated using only one process. Also, by using the semi-solid billet having viscosity greater than liquid, the generation of an air bubble is prevented, and the damage caused by shrinkage is reduced.
申请公布号 KR20010015979(A) 申请公布日期 2001.03.05
申请号 KR20000048204 申请日期 2000.08.17
申请人 KIM, IM YONG 发明人 KIM, IM YONG
分类号 B22D18/00;(IPC1-7):B22D18/00 主分类号 B22D18/00
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