| 摘要 |
PURPOSE: A system for an optical transceiving module and package structure thereof are provided to form a micro lens on one side of an optical transmission board, and to attach a solder bump for alignment bonding with an optical element chip on the opposite side, so as to automatically position the optical element in a focal distance of the micro lens when connecting the optical element and the solder bump to enhance an arrangement degree. CONSTITUTION: Micro lens arrays(208,228) are formed on one side of optical transmission boards(206,226). Optical element arrays(202,222) are arrayed on a board position corresponding to a focal distance between the micro lens arrays(208,228) and the optical element arrays(202,222), and are soldered vertically with the optical transmission boards(206,226). Printed circuit boards(PCBs,201,221) are connected with both ends of the optical transmission boards(206,226), and surround the optical element arrays(202,222) by having predetermined spaces(203,223). In the optical transmission boards(206,226) and a pad of a light detection chip or a light source, the boards and chip pad are vertically bonded through a solder bumps(204,224) for slip chips. A bonding pad and bonding material(210,230) bond the optical transmission boards(206,226) and the PCBs(201,221). An optical transmission module(200) is distant from an optical receiving module(220) at the focal distance, and the modules(200,220) are arrayed oppositely to make the micro lens arrays(208,228) mutually arrayed. Fan coolers(214,234) are formed around the optical element arrays(202,222) in order to reduce heat generated when an optical element is driven. The fan coolers(214,234) are operated only when the optical element is driven. |
