| 摘要 |
A wafer-level micro-cap package consists of an assortment of small caps (16) molded onto a material with adjustable shapes and sizes to serve as protective structure against hostile environments associated with packaging or handling. It may also include a surface modification which enhances its adhesion to the MST wafer (12), and depending on the application, the molded cap (16) can be designed and modified to facilitate additional functions, such as optical, electrical, mechanical, and chemical, which are not easily achieved in the device by traditional means. |
