| 摘要 |
PURPOSE: An improved baffle of an etching apparatus used for a fabrication of a semiconductor device is provided to prevent a slit in the baffle from clogging with polymers produced in the etching apparatus. CONSTITUTION: The etching apparatus includes a chuck for supporting a wafer thereon, a cathode electrode disposed under the chuck, and a baffle having a central hole receiving the cathode electrode therein and a peripheral part surrounding the central hole. The baffle is horizontally placed in the apparatus, dividing the inside of the apparatus into a processing space thereon and a vacuum line thereunder. Furthermore, the baffle has a plurality of slits radially formed in the peripheral part. In particular, a cross-sectional shape of the slit has an incline plane(33) of 45 degrees. Therefore, the polymers produced in the apparatus can be easily discharged to the vacuum line through the slanting slits without clogging the slits.
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