| 摘要 |
PURPOSE: A bonding structure is provided to enhance bonding strength by forming a coating layer on the bottom of a rail to be contacted with a panel to improve close contacting between the rail and the panel. CONSTITUTION: Before a panel and a rail are butted and anode bonded, aluminum or bismuth is coated with a thickness of 1000 to 10000 angstroms on the bottom of the rail to be bonded with the panel. This coat improves surface illuminance of the rail bottom to enhance close contacting between the panel and the rail, and increase the contacting surface. Then, a uniform voltage is applied to the panel. A chemical reaction with oxygen ion moved toward the rail from the panel is promoted to form a metal oxide(11) such as Al2O3 or Bi2O3 at the interface of the panel(2) and the rail(8). A strong metal compound is formed to enhance bonding strength.
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