METHOD FOR MANUFACTURING CARRIER TAPE FOR STACKED FLIP CHIP PACKAGE

摘要

PURPOSE: A method for manufacturing a carrier tape for a stacked flip chip package is provided to achieve high reliability. CONSTITUTION: A bottom adhesive film is prepared for insulating a semiconductor chip(10). A metal film is adhered to the bottom adhesive film(20). A pattern is formed to make a bump connection unit on the metal film(30). Then an upper adhesive film is adhered to the on the metal film(40). The upper/bottom adhesive film is used as an ASF(anisotropic conductive film) having uniform conductive particles or an insulative adhesive film.