| 摘要 |
PURPOSE: Provided is an epoxy resin composition for semiconductor package, which has absorptivity, thermal decomposition resistance, and formability without a flame retardant which generates a by-product harmful to a human body and environment. CONSTITUTION: The epoxy resin composition for semiconductor package comprises 5.0-15.0wt.% of multi-aromatic epoxy resin represented by formula 1; 1.99-9.5wt.% of multi-aromatic curing agent or a curing agent mixed with multi-aromatic curing agent and phosphorus modified phenol novolac curing agent; 0.002-0.25wt.% of curing accelerator; 74-90wt.% of inorganic filler; and 0.02-1.0wt.% of coupling agent. |
