| 摘要 |
A first substrate may be joined to a second substrate using an adhesive body. The adhesive body is formed from an adhesive composition containing at least one epoxy resin, at least one heat-activatable curing agent, and at least one radiation-curable compound. A first surface of the adhesive body is exposed to an amount of radiation effective to cure at least a portion of the at least one radiation-curable compound present in proximity to such first surface, thereby rendering said first surface less tacky and/or more resistant to deformation. A second surface of the adhesive body is then applied to a surface of said first substrate. A surface of the second substrate is thereafter positioned proximate to or in contact with the first surface of the adhesive body and the adhesive body heated to a temperature effective to activate the heat-activated curing agent and induce curing of the at least one epoxy resin.
|
