CHIP SCALE SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A chip scale semiconductor package is provided to maximize supporting stability of solder balls and to minimize the semiconductor package in size, by forming a slim-type structure in a fan-out type semiconductor package. CONSTITUTION: A semiconductor chip has a plurality of bonding pads that are disposed along the center of a surface and separated by a constant interval. A pair of stress mitigating films is divided into right and left parts with reference to the bonding pads, of which one surface is settled on the semiconductor chip and the other surface is extended to the outside of the chip. A pair of adhesive tapes are settled on the surface of each stress mitigating film, and a plurality of solder ball windows are disposed in the respective surfaces. The adhesive tapes are divided into right and left parts with reference to the bonding pads, of which one surface corresponds to the surface of the chip and the other surface is extended to the outside of the chip. Beam leads are intervened between the stress mitigating films and polyimide tapes, wherein one end portion of the beam leads is exposed to the surface of the polyimide tapes through the solder ball windows and the other end portion is exposed to a side of the polyimide film to be electrically connected to the bonding pads. A plurality of solder balls is settled on the solder ball windows. A pair of supporting films is installed on both sides of the semiconductor chip.