ATMOSPHERIC PRESSURE CHEMICAL VAPOR DEPOSITION EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR

摘要

PURPOSE: An atmospheric pressure chemical vapor deposition(APCVD) equipment for manufacturing a semiconductor is provided to control local non-uniformity of a thickness in a periphery of a wafer, by depositing a layer while the wafer fixed in a revolving plate revolves. CONSTITUTION: A layer is deposited while a wafer(4) is transferred from an entrance of a reaction chamber to an exit by a belt installed in a lower portion of the reaction chamber. A revolving axis(12) is fixed in the belt at regular intervals, and a revolving plate(13) in which the wafer can settle is installed in an upper end of the revolving axis, so that the wafer is settled for transfer.