APPARATUS FOR PLANARIZING SEMICONDUCTOR SUBSTRATE

摘要

PURPOSE: An apparatus for planarizing a semiconductor substrate is provided to control a foreign substance and to guarantee uniformity of a polishing rate, by minimizing the foreign substance or a scratch which could be generated on a film surface after a polishing process, and by controlling a phenomenon that slurry particle is left on a pad groove as a remnant. CONSTITUTION: A pad supporting unit(2) supports a pad(1)of a chemical mechanical polishing(CMP) apparatus. A head supporting unit(4) supports a head(3). An electrical bias is applied between the pad supporting unit and the head supporting unit by a load applying unit(5) when a wafer is polished.