METHOD FOR MANUFACTURING CHIP SCALE TYPE SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for manufacturing a chip scale type semiconductor package is provided to control a defective factor which could be generated on a polyimide tape during a process for adhering an elastomer layer to the polyimide tape, by having the elastomer layer and the polyimide tape maintain cohesion higher than a predetermined level without an additional heating process. CONSTITUTION: On a wafer in which a plurality of semiconductor chips having a circuit are defined is applied a polyimide layer for covering the semiconductor chips. An elastomer layer is applied on the polyimide layer. The polyimide layer and the elastomer layer are patterned to have sizes corresponding to the respective semiconductor chips so that polyimide patterns and elastomer patterns are stacked on the wafer. The wafer is sawed while the polyimide patterns and the elastomer patterns are stacked so that the semiconductor chips are split up into individuals. The semiconductor chips are attached to a polyimide tape while the polyimide patterns and the elastomer patterns are intervened.