PROCEDE DE FABRICATION D'UN DISPOSITIF ELECTRONIQUE PORTABLE COMPORTANT UNE ETAPE DE SURMOULAGE DIRECTEMENT SUR LE FILM SUPPORT

摘要

The invention concerns a method for making a portable electronic device comprising at least an integrated circuit chip (1) transferred onto a support strip (14) consisting of a dielectric film (15) laminated on a contact gate (18), the integrated circuit chip (1) being electrically connected to the contact gate (18). The invention is characterised in that it comprises the following steps: overmoulding chips (1) and their connections (17) to the contact gate (18) directly on the support strip (14) with an overmoulding material (50); cutting around the chips (1) and its connections (17) so as to obtain the devices (100).