PROCEDE DE PROTECTION DE PUCES DE CIRCUIT INTEGRE PAR DEPOT DE COUCHE MINCE ISOLANTE

摘要

The invention relates to a method for protecting integrated circuit chips (100) on a silicon wafer, comprising the following stages: cutting the silicon wafer in such a way as to separate the integrated circuit chips (100); depositing an electrically insulating material (150) on the back panel (104) and the sides (106) of each integrated circuit chip (100) in the form of a thin layer. This thin layer can be deposited using known techniques, especially by cathode sputtering or by vacuum evaporation.