发明名称 HORIZONTAL HIGH CURRENT DENSITY ELECTROPLATING CELL
摘要 PURPOSE: A horizontal high current density electroplating cell is provided to quality and actual yield of plated steel by minimizing surface defects caused by flow rate nonuniformity of a plating solution occurred in an existing horizontal high current density electroplating cell. CONSTITUTION: A horizontal high current density electroplating cell comprises conductor rolls (10), a plating solution ejector (20), plating solution channels (30), and a plurality of insoluble anodes (40), wherein a plating solution is ejected into the plating solution channel in the same direction as the transfer direction of a steel plate (50) through the plating solution ejector (20) as transferring the steel plate (50) in one direction through conductor rolls (10) so that metal ions are electrodeposited on the steel plate (50). Each inclined dams are installed on upper and lower parts of the plating solution channel between the insoluble anodes (40) and the plating solution ejector (20). The dams are installed at positions of 1/3 to 1/2 of a distance between nozzle outlet of the plating solution ejector (20) and center of the insoluble anodes (40) based on the nozzle outlet. The dams are formed in a trapezoid shape.
申请公布号 KR20010017304(A) 申请公布日期 2001.03.05
申请号 KR19990032751 申请日期 1999.08.10
申请人 POHANG RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE &TECHNOLOGY 发明人 KIM, HYEONG SU
分类号 C25D17/00;(IPC1-7):C25D17/00 主分类号 C25D17/00
代理机构 代理人
主权项
地址