TRAY FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A tray for a semiconductor package is provided to prevent a lead located at corners of the semiconductor package from being collided with an inner wall of a pocket, by locating the lead in a groove formed on the inner wall of the pocket. CONSTITUTION: A plurality of pockets are dented as a rectangular shape larger than a semiconductor package(30) in the inside regarding a surface, and is lattice-disposed, so as to receive the rectangular semiconductor package. A rib(54) is protruded to a predetermined height from the bottom of the pocket, separated from the inner wall of the pocket by a predetermined interval. The rib supports a package body of the semiconductor package received in the pocket, wherein the rib makes a lead(34) of the semiconductor package separated from the inner wall of the pocket by a predetermined interval. A groove is convexly formed from an inner wall of respective corners of the pocket to the inside. Even if the semiconductor package is received in the pocket as it is twisted, outermost leads(34a) located at respective corners of the semiconductor package are positioned in the groove, so that the lead is prevented from being collided with the inner wall of the pocket.