| 发明名称 |
Semiconductor wafer cutting apparatus has chuck table to convey wafer from wafer mounting area to cutting area in X-axis direction |
| 摘要 |
<p>The cassette area (12), wafer mounting area (15) and cleaning area (19) of the cutting apparatus are arranged in the Y-axis direction on a straight line. The cutting area (17) is arranged in the X-axis direction crossed orthogonally to wafer mounting area in Y-axis direction. A chuck table (14) conveys the wafer from the wafer mounting area to cutting area in the X-axis direction.</p> |
| 申请公布号 |
DE10030183(A1) |
申请公布日期 |
2001.03.01 |
| 申请号 |
DE2000130183 |
申请日期 |
2000.06.20 |
| 申请人 |
DISCO CORP., TOKIO/TOKYO |
发明人 |
UMAHASHI, TAKAYUKI |
| 分类号 |
H01L21/304;B28D5/00;B28D5/02;H01L21/301;(IPC1-7):H01L21/301;B26D7/01;B26D7/27;B26D1/36 |
主分类号 |
H01L21/304 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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