发明名称 WIRING BOARD, METHOD OF MANUFACTURING WIRING BOARD, ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, CIRCUIT BOARD AND ELECTRONIC APPARATUS
摘要 <p>A wiring board comprises a first board (10) having a first wiring pattern (12) and including an area (14) on which an electronic element is mounted, and a second board (20) having a second wiring pattern (22) connected electrically with the first wiring pattern (12). The second board includes an area (26) to which at least part of the first board (10) is attached and an area (24) on which an electronic element is mounted.</p>
申请公布号 WO2001015228(P1) 申请公布日期 2001.03.01
申请号 JP2000005395 申请日期 2000.08.11
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