WIRING BOARD, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, CIRCUIT BOARD AND ELECTRONIC DEVICE

摘要

A wiring board includes an upper board (30) having an upper wiring pattern (32) and a lower board (40) having a lower wiring pattern (42), and the upper board is attached to the lower board. The lower wiring pattern (42) includes a first lower land (53) formed in a central part of a first area (50) and connected with the upper wiring pattern (32); a second lower land (64) formed in a second area (60) and connected electrically with a second electronic element; and a plurality of lower connections (45) running outside the central part of the first area (50) to connect the first lower land (53) and the second lower land (64).